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Laser Soldering Application Market For PCB Circuit Boards

Views: 5     Author: Site Editor     Publish Time: 2023-11-23      Origin: Site


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Laser Soldering Application Market For PCB Circuit Boards

PCB is the abbreviation of Printed Circuit Board. It is one of the important components of the electronics industry and is used in almost all electronic products. Its main function is to realize the electrical interconnection between various components. The PCB is composed of an insulating base plate, connecting wires and pads for assembling and welding electronic components. It has the dual functions of conductive lines and insulating base plates. Its manufacturing quality can directly affect the reliability of electronic products. It is the basic industry for today's electronic information product manufacturing and is also the industry with the largest output value among the global electronic component industry segments.

PCB has a wide range of application markets, including consumer electronics, automotive electronics, communications, medical care, military industry, aerospace, etc. At present, consumer electronics and automotive electronics are developing rapidly and have become the main areas of PCB application. For a long time, global PCB output value has been mainly concentrated in North America, Europe, Japan and other regions. After 2000, the focus of the PCB industry began to shift to Asia, especially the Chinese market. In 2009, mainland China's PCB industry output value accounted for approximately 1/3 of the world's total. By 2017, it had reached 50.5%, accounting for half of the global PCB output value.

Among PCB applications in consumer electronics, FPC is developing the fastest, and its proportion in the PCB market continues to increase. FPC is the abbreviation of Flexible Printed Circuit. It is a highly reliable circuit board made of polyimide (PI, also known as PI cover film in the industry) or polyester film as the base material. It is an excellent flexible printed circuit board with the characteristics of high wiring density, light weight, thin thickness and good bendability. Under the current trend of smart, thin and light mobile electronic products, FPC is widely used due to its advantages such as high density, light weight, thin thickness, bending resistance, flexible structure, and high temperature resistance, and has become the current trend to meet the miniaturization and mobile requirements of electronic products. the only solution.

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